Presentation
From Design to Defense: Shaping the Future of Microelectronics Security
DescriptionThe semiconductor attack surface is increasingly susceptible to threats and malicious inclusion. New attack vectors are emerging, most recently through directed software attacks that exploit hardware vulnerabilities.
Efforts to create a more secure and resilient semiconductor supply chain – the backbone of critical infrastructure – are gaining traction in the US and the EU. Private industry and public agencies recognize that a rigorous and tightly coupled security design sign-off is essential to achieve that goal.
The integration of microelectronic security into the semiconductor life cycle is uncharted territory for conventional semiconductor design flows. Solutions range from incremental improvements of existing verification processes to disruptive new design methodologies aimed at cyber-hardening and embedding resilience against attacks into the components' DNA.
Our panel will discuss strategies and trade-offs in advancing trusted and cyber-resilient microelectronics from cradle to grave. The panel will highlight the vital role of collaboration within the semiconductor and EDA industries as well as with security researchers. We are delighted to have the leading voices in the semiconductor industry join us to discuss the crucial challenges facing cybersecurity in microelectronics designs.
Efforts to create a more secure and resilient semiconductor supply chain – the backbone of critical infrastructure – are gaining traction in the US and the EU. Private industry and public agencies recognize that a rigorous and tightly coupled security design sign-off is essential to achieve that goal.
The integration of microelectronic security into the semiconductor life cycle is uncharted territory for conventional semiconductor design flows. Solutions range from incremental improvements of existing verification processes to disruptive new design methodologies aimed at cyber-hardening and embedding resilience against attacks into the components' DNA.
Our panel will discuss strategies and trade-offs in advancing trusted and cyber-resilient microelectronics from cradle to grave. The panel will highlight the vital role of collaboration within the semiconductor and EDA industries as well as with security researchers. We are delighted to have the leading voices in the semiconductor industry join us to discuss the crucial challenges facing cybersecurity in microelectronics designs.
Moderator
Event Type
DAC Pavilion Panel
TimeWednesday, June 2611:15am - 12:00pm PDT
LocationDAC Pavilion, Level 2 Exhibit Hall
DAC Pavilion