Presenter Full Program · Contributors · Organizations · Search Program · Flagged · Happening NowMore…Search ProgramFlaggedHappening NowJunfa MaoShanghai Jiao Tong UniversityPresentationsResearch ManuscriptThermal Resistance Network Derivative (TREND) Model for Efficient Thermal Simulation and Design of ICs and PackagesEDADesign Methodologies for System-on-Chip and 3D/2.5D System-in-Package
