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DTSTAMP:20240626T180033Z
LOCATION:3008\, 3rd Floor
DTSTART;TZID=America/Los_Angeles:20240626T171500
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UID:dac_DAC 2024_sess133_RESEARCH979@linklings.com
SUMMARY:3D-Carbon: An Analytical Carbon Modeling Tool for 3D and 2.5D Inte
 grated Circuits
DESCRIPTION:Research Manuscript\n\nYujie Zhao, Yang (Katie) Zhao, Cheng Wa
 n, and Yingyan (Celine) Lin (Georgia Institute of Technology)\n\nEnvironme
 ntal sustainability is a critical concern for Integrated Circuits (ICs) th
 roughout their entire life cycle, particularly in manufacturing and use. M
 eanwhile, ICs using 3D/2.5D integration technologies have emerged as promi
 sing solutions to meet the growing demands for computational power. Howeve
 r, there is a distinct lack of carbon modeling tools for 3D/2.5D ICs. Addr
 essing this, we propose 3D-Carbon, an analytical carbon modeling tool desi
 gned to quantify the carbon emissions of 3D/2.5D ICs throughout their life
  cycle. 3D-Carbon factors in both potential savings and overheads from adv
 anced integration technologies, considering practical deployment constrain
 ts like bandwidth. We validate 3D-Carbon's accuracy against established ba
 selines and illustrate its utility through case studies in autonomous vehi
 cles. We believe that 3D-Carbon lays the initial foundation for future inn
 ovations in developing environmentally sustainable 3D/2.5D ICs.\n\nTopic: 
 EDA\n\nKeyword: Design Methodologies for System-on-Chip and 3D/2.5D System
 -in-Package\n\nSession Chairs: Furkan Eris (Boston University) and Nader S
 ehatbakhsh (University of California, Los Angeles)
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