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DTSTAMP:20240626T180033Z
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UID:dac_DAC 2024_sess145_RESEARCH1053@linklings.com
SUMMARY:Efficient ILT via Multigrid-Schwartz Method
DESCRIPTION:Research Manuscript\n\nShuyuan Sun and Fan Yang (Fudan Univers
 ity); Bei Yu (The Chinese University of Hong Kong); and Li Shang, Dian Zho
 u, and Xuan Zeng (Fudan University)\n\nInverse lithography technology (ILT
 ) is one of most powerful resolution enhancement technologies (RETs) used 
 in chip manufacturing. Due to the high computational requirements of ILT, 
 large layouts are often split into smaller tiles and then assembled to obt
 ain the final result. This paper states the challenges that may emerge dur
 ing layout assembly and proposes to use the multigrid Schwarz method to ad
 dress these issues. Experimental results show that our method achieves com
 parable quality results to full-chip correction and exhibits better effici
 ency.\n\nTopic: Design\n\nKeyword: Design for Manufacturability and Reliab
 ility\n\nSession Chairs: Shao-Yun Fang (National Taiwan University of Scie
 nce and Technology) and Biying Xu (The Hong Kong University of Science and
  Technology (Guangzhou))
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