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BEGIN:VEVENT
DTSTAMP:20240626T180033Z
LOCATION:Level 2 Exhibit Hall
DTSTART;TZID=America/Los_Angeles:20240624T170000
DTEND;TZID=America/Los_Angeles:20240624T180000
UID:dac_DAC 2024_sess232_ETPOST013@linklings.com
SUMMARY:On Cloud Secured Collaboration From chips to embedded systems
DESCRIPTION:Engineering Track Poster\n\nSmriti Joshi and Manuel Rei (Dassa
 ult Systèmes)\n\nAbstract :\n\nThe need for a secured collaboration arises
  from the imperative to protect sensitive information and ensure the integ
 rity of shared data. In order to face strong industrial constraints, indus
 try players must ensure that communication between the different links in 
 their value chain is fluid. In this paper, we present a secured collaborat
 ion platform on cloud to orchestrate, share and deliver data between diffe
 rent semiconductor OEMs and suppliers. It provides a collaborative space w
 here engineers can work from a small device to a complex system. It is pos
 sible to exchange large multi format data, accelerate product development 
 with co-innovation and enables collaboration between OEM and supply chain.
  It helps to cut excess costs and deliver products to the customer faster.
  It ensures full security and traceability to preserve and capitalize IP f
 rom different stakeholders. Shifting to this secured cloud platform signif
 icantly improves collaboration across the value chain by managing multitud
 e of data and different version levels. We will showcase how this on cloud
  solution optimize the data exchange between OEMs and multiple suppliers.\
 n\nTopic: Back-End Design, Embedded Systems, Front-End Design, IP
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