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BEGIN:VEVENT
DTSTAMP:20240626T180034Z
LOCATION:Level 2 Exhibit Hall
DTSTART;TZID=America/Los_Angeles:20240624T170000
DTEND;TZID=America/Los_Angeles:20240624T180000
UID:dac_DAC 2024_sess232_ETPOST168@linklings.com
SUMMARY:Holistic Approach on 3DIC Planning
DESCRIPTION:Engineering Track Poster\n\nVenkata Chinni, SRUTI L SHRIDHAR, 
 Tadasa Mahapatra, and Sandeep Jadhav (Samsung)\n\n3DIC design planning has
  been one of the interesting and challenging areas of research and develop
 ment in recent times due to its higher demand and technological improvemen
 t that can cater to latest requirements in IC design.\nThis piece of work 
 has been carried out to explore the different ventures in this space that 
 can result in efficient optimization of performance and area parameters th
 ereby overcoming different challenges in the process.\nThe key is to estab
 lish proper die to die connections and effectively develop a three-dimensi
 onal structure that is fully functional.\n\nTopic: Back-End Design, Embedd
 ed Systems, Front-End Design, IP
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