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BEGIN:VEVENT
DTSTAMP:20240626T180034Z
LOCATION:Level 2 Exhibit Hall
DTSTART;TZID=America/Los_Angeles:20240624T170000
DTEND;TZID=America/Los_Angeles:20240624T180000
UID:dac_DAC 2024_sess232_ETPOST210@linklings.com
SUMMARY:2.5D Design Breakthrough: Unleashing the Power of Automated EMIB B
 ridges.
DESCRIPTION:Engineering Track Poster\n\nSam Mirza (Intel Corporation)\n\nW
 ith the growing demand for the heterogenous chip interconnect there is a d
 ire need of a unified EDA design environment that effectively handles the 
 complex logical interconnects, physical layout design, EE, mechanical & th
 ermal simulations.\nIntel's embedded multi-die interconnect bridge (EMIB) 
 is an approach to in-package high-density interconnect of heterogeneous ch
 ips. With the increasing demand from Intel internal and IFS customer base 
 there is a bigger challenges for tools to handle highly complex design wit
 h 10s of complex chiplets and their connectivity management, low latency h
 igh bump count layout and reliable interconnects that can be seamlessly si
 mulate with EDA tools.\nIntel's collaboration with Cadence on automating t
 he 2.5D design is a significant step towards making EMib technology a more
  widely adopted and efficient solution for high-performance chip design. T
 his will significantly benefit other companies and researchers working in 
 this field.\n\nTopic: Back-End Design, Embedded Systems, Front-End Design,
  IP
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