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BEGIN:VEVENT
DTSTAMP:20240626T180033Z
LOCATION:Level 2 Exhibit Hall
DTSTART;TZID=America/Los_Angeles:20240625T170000
DTEND;TZID=America/Los_Angeles:20240625T180000
UID:dac_DAC 2024_sess233_ETPOST133@linklings.com
SUMMARY:DIGITAL CONTINUITY FROM SEMICONDUCTOR EBOM TO MBOM AND BILL OF PRO
 CESS
DESCRIPTION:Engineering Track Poster\n\nSmriti Joshi and Manuel Rei (Dassa
 ult Systèmes)\n\nAbstract :\n\nDigital continuity plays a crucial role in 
 modern semiconductor industry. Semiconductor design and manufacturing comp
 lexity include the need for sophisticated process control, rigorous qualit
 y assurance, and seamless integration with upstream and downstream operati
 ons. This topic explores the concept of digital continuity from design to 
 manufacturing through model-based approach and displaying its impact on op
 timizing the entire product development, manufacturing lifecycle, end-to-e
 nd traceability and resource optimization. In this paper, we are ensuring 
 seamless information flow from the Engineering BOM to Manufacturing BOM to
  the Bill of process (BOP) and resources. The integration of these compone
 nts becomes imperative for efficient design and product lifecycle manageme
 nt. It also explores the role of Product Lifecycle Management (PLM), plann
 ing optimization and life cycle management.\n\nTopic: Back-End Design, Emb
 edded Systems, Front-End Design, IP
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