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DTSTAMP:20240626T180033Z
LOCATION:Level 2 Exhibit Hall
DTSTART;TZID=America/Los_Angeles:20240625T170000
DTEND;TZID=America/Los_Angeles:20240625T180000
UID:dac_DAC 2024_sess233_ETPOST188@linklings.com
SUMMARY:Next-Gen comprehensive IR analysis with Ansys SigmaAV
DESCRIPTION:Engineering Track Poster\n\nPranav Ranganathan, Medha Kulkarni
 , and Chip Stratakos (Microsoft) and Veshal Sridhar and Mallik Vusirikala 
 (Ansys)\n\nIn advanced technology nodes, metal pitches have not scaled wit
 h area which has led to increased cross-coupling between instances where s
 witching instances in the immediate vicinity have a significant impact on 
 an instance's IR drop, with a measurable impact from areas outside the imm
 ediate vicinity from the shared PDN. In order to ensure that there are no 
 IR drop escapes, it is imperative to undertake two separate analyses, the 
 first where the local region around an instance is sensitized to expose al
 l attacker-victim combinations that can happen over the course of product 
 lifetimes, obtained with SigmaDvD, and the second, areas outside the local
  regions modelled to represent design behavior, analyzed with traditional 
 transient Dynamic IR. The capability to combine both analyses does not exi
 st in present tools. We present SigmaAV, a brand-new engine from Ansys tha
 t merges SigmaDvD and transient Dynamic IR to derive an IR drop that encom
 passes the impact from local aggressors with IR drop events outside the lo
 cal vicinity.  In the presentation, we review what this technology is, the
  trends that we saw on our designs and how we leverage its exhaustive natu
 re in IR-STA for Fmax improvement and power, area reduction.\n\nTopic: Bac
 k-End Design, Embedded Systems, Front-End Design, IP
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