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PRODID:Linklings LLC
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TZID:America/Los_Angeles
X-LIC-LOCATION:America/Los_Angeles
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DTSTART:19700308T020000
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DTSTART:19701101T020000
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BEGIN:VEVENT
DTSTAMP:20240626T180034Z
LOCATION:Exhibitor Forum\, Level 1 Exhibit Hall
DTSTART;TZID=America/Los_Angeles:20240626T134500
DTEND;TZID=America/Los_Angeles:20240626T150000
UID:dac_DAC 2024_sess280_EF119@linklings.com
SUMMARY:Visualizing the Future of Multi-die Design with Ansys & NVIDIA Omn
 iverse
DESCRIPTION:Exhibitor Forum\n\nRich Goldman (Ansys) and Baskar Rajagopalan
  (NVIDIA)\n\nAnsys and Nvidia collaborate closely to enable designers to b
 ring a new paradigm to IC design: Visualizing and optimizing multi-die des
 igns with NVIDIA’s  Omniverse technology. In combination with Ansys electr
 omagnetic, thermal, and mechanical simulation it can provide capabilities 
 never before seen in IC design. This session features representatives from
  Ansys and NVIDIA demonstrating Ansys solutions operating with NVIDIA’s Om
 niverse for practical optimization solutions. The session will also cover 
 key aspects of the companies’ collaborations on AI and GPU design and enab
 lement, as debuted in Jensen Huang’s GTC 2024 keynote.
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