Presentation
On Cloud Semiconductor Virtual Twin Experience Universe
DescriptionGlobal semiconductor chips shortage disrupted the production in recent years affecting a wide range of industries. Despite the prevailing difficulties in keeping up with demand, and geo-politics that require moving from a global to sovereign supply chain. The semiconductor ecosystem is actively pursuing future solutions, including establishing new manufacturing sites and preparing the upcoming workforce. All these solutions are time taking and costly. In this scenario virtual twin, experience looks like a plus which can help companies bring down the cost and efforts. In this session, we will explain our cloud based semiconductor virtual twin experience to highlight how it can enable end-to-end digital continuity from chips to fab. This approach is applicable to the entire semiconductor ecosystem from design, to manufacturing, to material, to process, to equipment, to cleanroom/fab, which scales collaborative innovation across all the stages and all stakeholders. The following scenarios are covered by our solutions:
• from chips to systems
• project planning, requirement, system architecture and validation
• from lab to fab
• material, manufacturing process, equipment, process flow and operation
We will present how digital continuity and traceability utilize the data analytics and advanced cutting edge modeling techniques to enhance decision-making and minimize potential risks in semiconductor virtual twin experience universe. In addition, we will see how a model based innovation platform on IP secure cloud enables
• Virtualization of physical experimentation and tests
• Industry ecosystem collaboration, fostering private-public partnership between different IDM, OEM, Foundry, fabless, academia, research, assembly and test, to work together
• from chips to systems
• project planning, requirement, system architecture and validation
• from lab to fab
• material, manufacturing process, equipment, process flow and operation
We will present how digital continuity and traceability utilize the data analytics and advanced cutting edge modeling techniques to enhance decision-making and minimize potential risks in semiconductor virtual twin experience universe. In addition, we will see how a model based innovation platform on IP secure cloud enables
• Virtualization of physical experimentation and tests
• Industry ecosystem collaboration, fostering private-public partnership between different IDM, OEM, Foundry, fabless, academia, research, assembly and test, to work together
Event Type
Exhibitor Forum
TimeTuesday, June 255:00pm - 5:30pm PDT
LocationExhibitor Forum, Level 1 Exhibit Hall