Presentation
EDA for Heterogeneous Integration: What Lies Ahead?
DescriptionHeterogeneous integration poses new challenges to electronic design automation (EDA) and packaging communities and demands innovative solutions that must be built together with tight-knit collaborations. This special session is focused on design, automation, and thermal management aspects of heterogeneous integration. These very important aspects are not very well explored and covered by the mainstream research on physical design and packaging, as presented in the regular paper tracks. Attendees will learn about exciting developments at the intersection of design automation, manufacturing, and architecture on heterogeneous integration. Attendees will also be presented with a set of design and integration challenges that lie ahead, as well as current state-of-the-art solutions to these problems.
Event Type
Special Session (Research)
TimeTuesday, June 2510:30am - 12:00pm PDT
Location3006, 3rd Floor
EDA