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Presentation

Systems Foundry - a journey from 'System on a Chip' to 'System of Chips'
DescriptionIn this keynote, Dr. Gary Patton will introduce the fundamental concepts driving the vision of a 'Systems Foundry', including a standards-based approach to assemble heterogenous dies. Dr. Patton will also cover the factors driving the inevitable need for disaggregation; factors like reticle limit, thermal constraints, cost, yield, etc., among others that are especially exacerbated in the need to satisfy the demands of HPC designs in the AI era. In addition, Dr. Patton will go over the transformative journey at Intel over the last 4-5 years that has helped orient the execution towards enabling the vision of a Systems Foundry. A journey that encompasses delivering to a full breadth of EDA offerings and development of advanced packaging capabilities, to name a few. The work is not done, however; the EDA & IP ecosystem has a vital role to play in this vision - to enable a seamless 3DIC design platform for advanced packaging implementation & modeling, AI-driven 3D exploration and System-Technology Co-Optimization while tackling challenges in the multi-physics domain. Intel has several collaborative projects with EDA to address these challenges, and Dr. Patton will end with a call to action to the ecosystem partners on continued partnership to realize this vision
Event Type
Keynote
Special Event
TimeTuesday, June 259:00am - 9:45am PDT
Location3007, 3rd Floor
Topics
Design