Presentation
Asleep at the Wheel? In-Cabin Monitoring for Automotive Safety.
DescriptionAccording to data provided by the World Health Organization, it is a grim reality that
more than 1.3 million people lose their lives annually due to the tragic outcomes of
road traffic accidents, further exacerbating the situation with a staggering 20 to 50
million individuals being left with non-fatal injuries. These disheartening statistics serve
as a stark reminder of the urgent need for improved safety measures in the automotive
industry.
Historically driven by the pursuit of creating vehicles that captivate and exhilarate
consumers, the automotive sector has increasingly shifted its focus toward fostering a
robust safety culture. This transformation has only sometimes been an organic
process, as governments worldwide have often found themselves leading the charge
in pushing for more excellent vehicular safety through stringent regulations. These
regulatory frameworks, which initially took root in Europe and China, have now been
rapidly disseminated globally. Consequently, automakers have found themselves
compelled to make safety an integral and non-negotiable facet of their automotive
solutions.
The impending European Safety Regulations, set to become a standard in the
industry, have been significantly motivated by the rapid evolution of automotive
technology and an unwavering commitment to ensuring the safety of both drivers and
passengers. A pivotal component of this technological revolution in the automotive
realm is interior sensing. It plays a critical role in monitoring drivers for distractions and
fatigue, as well as tracking the movements of vehicle occupants.
This distinguished panel of experts brings together some of the foremost sensor and
System-on-chip (SoC) suppliers and in-cabin monitoring specialists who are pivotal in
driving the burgeoning interior sensing market. Their collective aim is to deliberate on
various topics, ranging from emerging technology trends to innovative packaging
options, seamless connectivity, and integration points for Advanced Driver Assistance
Systems (ADAS), including the transformative Driver and occupant Monitoring System
technology.
Recognizing that human drivers are inherently prone to errors, safety technology
providers adopt a holistic systems approach to assist, enhance, and even assume
control of the driving task when necessary. In-cabin monitoring emerges as a crucial
element within this overarching strategy. Overcoming challenges related to cost,
packaging constraints, and system complexity, hardware and application vendors
continually push the boundaries of innovation, seeking novel ways to optimize their
designs to support efficient and cost-effective in-cabin monitoring solutions.
The panel discussion, featuring prominent figures from industry and University leaders
such as Seeing Machines, Qualcomm, Texas Instruments, Ambarella, OmniVision,
and TU Braunschweig, will delve deep into the dynamic Sensor and SoC market for
in-cabin monitoring. They will explore critical issues, including how in-cabin
monitoring technology underpins the global safety agenda, the preferences of
suppliers regarding packaging locations, the pros and cons of variousintegration approaches, and the implications for Original Equipment Manufacturers (OEMs) who must ensure that safety and convenience remain
paramount in their offerings. There are a variety of differing opinions, and it is
these differing opinions that will be brought forth in this panel.
The panel is aimed at students, researchers, and practitioners. Students will
understand the state of the art and the challenges. Researchers will be able to
examine open industrial problems which are still open, and industry practitioners will
be able to understand the available solutions and the industry trends.
The panel aims to engage in a comprehensive discussion surrounding critical
questions, including but not limited to:
How can we best support a low-cost and low-power consumption market?
Which aspect or component of Sensor and SoC design should we prioritize for future
advancements?
What are the foremost challenges associated with Artificial Intelligence (AI) in
designing sensors and SoCs?
Where should we channel our Research and Development (R&D) efforts?
Which packaging configurations are poised to dominate the automotive market?
How vital is cybersecurity in this context?
What obstacles do we face in implementing AI techniques for in-cabin monitoring?
How are these cutting-edge designs rigorously tested to ensure their efficacy and
safety?
more than 1.3 million people lose their lives annually due to the tragic outcomes of
road traffic accidents, further exacerbating the situation with a staggering 20 to 50
million individuals being left with non-fatal injuries. These disheartening statistics serve
as a stark reminder of the urgent need for improved safety measures in the automotive
industry.
Historically driven by the pursuit of creating vehicles that captivate and exhilarate
consumers, the automotive sector has increasingly shifted its focus toward fostering a
robust safety culture. This transformation has only sometimes been an organic
process, as governments worldwide have often found themselves leading the charge
in pushing for more excellent vehicular safety through stringent regulations. These
regulatory frameworks, which initially took root in Europe and China, have now been
rapidly disseminated globally. Consequently, automakers have found themselves
compelled to make safety an integral and non-negotiable facet of their automotive
solutions.
The impending European Safety Regulations, set to become a standard in the
industry, have been significantly motivated by the rapid evolution of automotive
technology and an unwavering commitment to ensuring the safety of both drivers and
passengers. A pivotal component of this technological revolution in the automotive
realm is interior sensing. It plays a critical role in monitoring drivers for distractions and
fatigue, as well as tracking the movements of vehicle occupants.
This distinguished panel of experts brings together some of the foremost sensor and
System-on-chip (SoC) suppliers and in-cabin monitoring specialists who are pivotal in
driving the burgeoning interior sensing market. Their collective aim is to deliberate on
various topics, ranging from emerging technology trends to innovative packaging
options, seamless connectivity, and integration points for Advanced Driver Assistance
Systems (ADAS), including the transformative Driver and occupant Monitoring System
technology.
Recognizing that human drivers are inherently prone to errors, safety technology
providers adopt a holistic systems approach to assist, enhance, and even assume
control of the driving task when necessary. In-cabin monitoring emerges as a crucial
element within this overarching strategy. Overcoming challenges related to cost,
packaging constraints, and system complexity, hardware and application vendors
continually push the boundaries of innovation, seeking novel ways to optimize their
designs to support efficient and cost-effective in-cabin monitoring solutions.
The panel discussion, featuring prominent figures from industry and University leaders
such as Seeing Machines, Qualcomm, Texas Instruments, Ambarella, OmniVision,
and TU Braunschweig, will delve deep into the dynamic Sensor and SoC market for
in-cabin monitoring. They will explore critical issues, including how in-cabin
monitoring technology underpins the global safety agenda, the preferences of
suppliers regarding packaging locations, the pros and cons of variousintegration approaches, and the implications for Original Equipment Manufacturers (OEMs) who must ensure that safety and convenience remain
paramount in their offerings. There are a variety of differing opinions, and it is
these differing opinions that will be brought forth in this panel.
The panel is aimed at students, researchers, and practitioners. Students will
understand the state of the art and the challenges. Researchers will be able to
examine open industrial problems which are still open, and industry practitioners will
be able to understand the available solutions and the industry trends.
The panel aims to engage in a comprehensive discussion surrounding critical
questions, including but not limited to:
How can we best support a low-cost and low-power consumption market?
Which aspect or component of Sensor and SoC design should we prioritize for future
advancements?
What are the foremost challenges associated with Artificial Intelligence (AI) in
designing sensors and SoCs?
Where should we channel our Research and Development (R&D) efforts?
Which packaging configurations are poised to dominate the automotive market?
How vital is cybersecurity in this context?
What obstacles do we face in implementing AI techniques for in-cabin monitoring?
How are these cutting-edge designs rigorously tested to ensure their efficacy and
safety?
Organizer
Moderator
Event Type
Research Panel
TimeTuesday, June 251:30pm - 3:00pm PDT
Location3014, 3rd Floor
AI
EDA