Presentation
Analytical Modeling and Electro-Thermal Benchmarking of 2.5D/3D Heterogeneous Integration for AI Computing
DescriptionMonolithic designs face significant fabrication costs and data movement challenges, especially when dealing with complex and diverse AI models. Advanced 2.5D/3D packaging promises high bandwidth and density to overcome these challenges but also introduces new electro-thermal constraints. This paper presents a suite of analytical performance models to enable efficient benchmarking of a 2.5D/3D AI system. These models cover various metrics of computing units, network-on-chip, and network-on-package. The results are summarized into a new tool, HISIM. Benefiting from the accuracy and efficiency of HISIM, we evaluate the potential of 2.5D/3D heterogeneous integration on representative AI algorithms under thermal constraints.
Event Type
Work-in-Progress Poster
TimeTuesday, June 256:00pm - 7:00pm PDT
LocationLevel 2 Lobby
AI
Autonomous Systems
Cloud
Design
EDA
Embedded Systems
IP
Security