Presentation
Invited: Thermal Design and Management for Heterogeneous Integration
DescriptionThermal-power challenges and increasingly expensive energy demands pose threats to the historical rate of increase in processor performance. Emerging energy-efficient computing schemes and heterogeneous 3D integration systems promise a substantial reduction in energy demand for emerging and growing computing needs. However, these conflicting trends have resulted in a substantial increase in both heat flux and power density (W/cm3), which makes it even more challenging to use conventional cooling technology solutions. High-performance, energy-efficient thermal management solutions from the device level to chip/package level are needed to tackle this thermal challenge. During this talk, I will first present the device level thermal conduction enhancement solutions using thermal metal via or thermal bumps for the microprocessor and LED packaging applications. The second part of this talk will focus on computational modeling, numerical optimization, microfluidic heatsink fabrications, and experimental investigations of advanced chip/package level thermal cooling solutions, including impingement jet cooling, manifold-based embedded microchannel cooling and cryogenic cooling.
Event Type
Special Session (Research)
TimeTuesday, June 2511:30am - 12:00pm PDT
Location3006, 3rd Floor
EDA