Session
EDA for Heterogeneous Integration: What Lies Ahead?
Session Chair
DescriptionHeterogeneous integration poses new challenges to electronic design automation (EDA) and packaging communities and demands innovative solutions that must be built together with tight-knit collaborations. This special session is focused on design, automation, and thermal management aspects of heterogeneous integration. These very important aspects are not very well explored and covered by the mainstream research on physical design and packaging, as presented in the regular paper tracks. Attendees will learn about exciting developments at the intersection of design automation, manufacturing, and architecture on heterogeneous integration. Attendees will also be presented with a set of design and integration challenges that lie ahead, as well as current state-of-the-art solutions to these problems.
Organizers: Tsung-Yi Ho, The Chinese University of Hong Kong; Chih-Ping Hung, Advanced Semiconductor Engineering
Organizers: Tsung-Yi Ho, The Chinese University of Hong Kong; Chih-Ping Hung, Advanced Semiconductor Engineering
Event TypeSpecial Session (Research)
TimeTuesday, June 2510:30am - 12:00pm PDT
Location3006, 3rd Floor
EDA
Presentations
10:30am - 11:00am PDT | Invited: Physical Design for Heterogeneous Integration: Challenges and Solutions | |
11:00am - 11:30am PDT | Invited: The Role of EDA as Chips Transform Into 3D Systems | |
11:30am - 12:00pm PDT | Invited: Thermal Design and Management for Heterogeneous Integration |