Presentation
Model Margining Algorithm for High Performance SOC closure
DescriptionIn today's rapidly evolving technological landscape, the demand for higher performance in System-on-Chip (SoC) designs is paramount. As applications become more complex and data-intensive, pushing performance boundaries is essential to meet the growing requirements of diverse industries such as artificial intelligence, 5G communications, and autonomous systems.
Achieving enhanced performance in SoCs ensures improved computational capabilities, faster data processing, and overall superior functionality, aligning with the ever-increasing expectations for speed and efficiency in modern electronic devices.
Developing high-performance System-on-Chip (SoC) designs presents a myriad of challenges. Ensuring the reliability and robustness of high-performance SoCs poses a significant challenge, with potential issues such as signal integrity, thermal management, and electromigration.
Design closure becomes intricate as timing, power, and noise margins need meticulous optimization to avoid bottlenecks. Additionally, the need to meet aggressive time-to-market goals while adhering to stringent cost constraints adds another layer of complexity.
Introducing a novel model margining algorithm for high-performance System-on-Chip (SoC) closure, this paper addresses the critical need for efficient design closure in advance semiconductor architectures. By enhancing margining techniques, our algorithm optimizes performance without compromising reliability, where margins are dynamically tailored for optimal design closure. This reduces any late surprises at signoff stage which otherwise would trigger rerunning of the entire Backend Implementation flow due to infeasibility of design closure. The paper also discusses the prior approaches and its limitations in optimal design closure for High Performance SoCs.
Achieving enhanced performance in SoCs ensures improved computational capabilities, faster data processing, and overall superior functionality, aligning with the ever-increasing expectations for speed and efficiency in modern electronic devices.
Developing high-performance System-on-Chip (SoC) designs presents a myriad of challenges. Ensuring the reliability and robustness of high-performance SoCs poses a significant challenge, with potential issues such as signal integrity, thermal management, and electromigration.
Design closure becomes intricate as timing, power, and noise margins need meticulous optimization to avoid bottlenecks. Additionally, the need to meet aggressive time-to-market goals while adhering to stringent cost constraints adds another layer of complexity.
Introducing a novel model margining algorithm for high-performance System-on-Chip (SoC) closure, this paper addresses the critical need for efficient design closure in advance semiconductor architectures. By enhancing margining techniques, our algorithm optimizes performance without compromising reliability, where margins are dynamically tailored for optimal design closure. This reduces any late surprises at signoff stage which otherwise would trigger rerunning of the entire Backend Implementation flow due to infeasibility of design closure. The paper also discusses the prior approaches and its limitations in optimal design closure for High Performance SoCs.
Event Type
Back-End Design
TimeMonday, June 2410:55am - 11:10am PDT
Location2008, 2nd Floor
Back-End Design
Design
Engineering Tracks