Presentation
Automated Workflow for Comprehensive Thermal Analysis of IC Package Designs
DescriptionTI supports various Packaging Technologies which brings forth the challenge of Thermal Modeling and Analysis, where design teams grapple with the intricacies of mastering thermal modeling tools for diverse package families. The current process involves time-consuming manual efforts in creating intricate package geometry and PCB setups with the CAD tools, often resulting in errors.
The collaborative dance between design teams and centralized units prolongs the thermal modeling iteration cycle to 2+ weeks. In response, an automated solution is proposed to streamline this process, reducing the timeline to around 2 days. This automation liberates design teams from the need for extensive CAD/modeling tool familiarity, empowering them to conduct thermal modeling independently without overreliance on centralized teams.
This shift toward automation not only addresses efficiency but also marks a practical evolution in product development. It promises a smoother journey through the complexities of thermal modeling and analysis, reflecting a commitment to innovation while maintaining a grounded approach to practical implementation.
The collaborative dance between design teams and centralized units prolongs the thermal modeling iteration cycle to 2+ weeks. In response, an automated solution is proposed to streamline this process, reducing the timeline to around 2 days. This automation liberates design teams from the need for extensive CAD/modeling tool familiarity, empowering them to conduct thermal modeling independently without overreliance on centralized teams.
This shift toward automation not only addresses efficiency but also marks a practical evolution in product development. It promises a smoother journey through the complexities of thermal modeling and analysis, reflecting a commitment to innovation while maintaining a grounded approach to practical implementation.
Event Type
Back-End Design
TimeTuesday, June 2511:42am - 12:00pm PDT
Location2008, 2nd Floor
Back-End Design
Design
Engineering Tracks