Presentation
A novel method to analysis the wafer defect patterns using an image matching algorithm based on deep neural networks
DescriptionAs semiconductor manufacturing technology has been rapidly advanced, conventional approaches cannot classify new wafer defect patterns without training. To overcome this, our study proposes an image matching-based search algorithm to analyse wafer defect patterns. The proposed algorithm finds the correlation of wafer defect patterns that determines the feature-based similarity between Wafer Bin Maps (WBMs). Besides, we propose a new metric called Match of Defects (MoD) score to perform robust searching by considering the size and location of defect patterns. Experimental results show that our method is effective on industrial WBM datasets called WM811K and MixedWM38.
Event Type
Work-in-Progress Poster
TimeTuesday, June 256:00pm - 7:00pm PDT
LocationLevel 2 Lobby
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