Presentation
Invited: The Role of EDA as Chips Transform Into 3D Systems
Description"As the electronics industry pivots from Moore's Law to More-than-Moore, we witness a convergence of technologies across IC and systems design. This fundamental shift in how we design today's products requires new advanced design flows that combine tools across the spectrum of EDA tools. One of the most critical capabilities of these system-level design flows is to enable seamless cross-domain co-design and analysis, allowing designers to achieve the highest performance and lowest cost products. The days of IC and package designers ‘throwing data over the wall' are over. Heterogeneous Integration (HI) is ushering in a new era of electronic product design with collaboration at its core – one that lives or dies on the seamless interaction between analog/digital IC teams and package design teams.
Chiplet-based architectures present a solution for most semiconductor and systems companies to enable More-than-Moore. System in a package (SiP) offers a flexible form factor while coming close to matching SoC performance, but with far lower overall cost, greater yield, and perhaps most importantly, faster time to market. While SiP as a packaging concept has been around for decades, the recent tsunami of designs adopting multi-chiplet architectures is truly a disruptive change.
The use of advanced packaging technologies to combine smaller, discrete chiplets into one system-in-package (SiP) not only pushes the need for more advanced multi-die packaging but it also makes packaging part and parcel of the process. Doing so significantly reduces dependence on Moore's Law at a time when building advanced monolithic system-on-chip (SoC) is no longer the best option from a cost and technology perspective.
This presentation will describe the challenges design teams face when pivoting from monolithic IC design to 3D heterogenous package design and how EDA addresses these challenges."
Chiplet-based architectures present a solution for most semiconductor and systems companies to enable More-than-Moore. System in a package (SiP) offers a flexible form factor while coming close to matching SoC performance, but with far lower overall cost, greater yield, and perhaps most importantly, faster time to market. While SiP as a packaging concept has been around for decades, the recent tsunami of designs adopting multi-chiplet architectures is truly a disruptive change.
The use of advanced packaging technologies to combine smaller, discrete chiplets into one system-in-package (SiP) not only pushes the need for more advanced multi-die packaging but it also makes packaging part and parcel of the process. Doing so significantly reduces dependence on Moore's Law at a time when building advanced monolithic system-on-chip (SoC) is no longer the best option from a cost and technology perspective.
This presentation will describe the challenges design teams face when pivoting from monolithic IC design to 3D heterogenous package design and how EDA addresses these challenges."
Event Type
Special Session (Research)
TimeTuesday, June 2511:00am - 11:30am PDT
Location3006, 3rd Floor
EDA