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Presenter

Ki-Ok Kim
Samsung
Presentations
Engineering Track Poster
3DIC prototype design and transient early thermal analysis
Back-End Design
Embedded Systems
Front-End Design
IP
Back-End Design
TSV KOZ separation 3DIC P&R area optimization methodology considering device impact by TSV
Back-End Design
Design
Engineering Tracks
Back-End Design
ML based PPA Push using DRV Prediction
Back-End Design
Design
Engineering Tracks