Presentation
3D-Carbon: An Analytical Carbon Modeling Tool for 3D and 2.5D Integrated Circuits
DescriptionEnvironmental sustainability is a critical concern for Integrated Circuits (ICs) throughout their entire life cycle, particularly in manufacturing and use. Meanwhile, ICs using 3D/2.5D integration technologies have emerged as promising solutions to meet the growing demands for computational power. However, there is a distinct lack of carbon modeling tools for 3D/2.5D ICs. Addressing this, we propose 3D-Carbon, an analytical carbon modeling tool designed to quantify the carbon emissions of 3D/2.5D ICs throughout their life cycle. 3D-Carbon factors in both potential savings and overheads from advanced integration technologies, considering practical deployment constraints like bandwidth. We validate 3D-Carbon's accuracy against established baselines and illustrate its utility through case studies in autonomous vehicles. We believe that 3D-Carbon lays the initial foundation for future innovations in developing environmentally sustainable 3D/2.5D ICs.
Event Type
Research Manuscript
TimeWednesday, June 265:15pm - 5:30pm PDT
Location3008, 3rd Floor
EDA
Design Methodologies for System-on-Chip and 3D/2.5D System-in-Package