Presentation
Holistic Approach on 3DIC Planning
Description3DIC design planning has been one of the interesting and challenging areas of research and development in recent times due to its higher demand and technological improvement that can cater to latest requirements in IC design.
This piece of work has been carried out to explore the different ventures in this space that can result in efficient optimization of performance and area parameters thereby overcoming different challenges in the process.
The key is to establish proper die to die connections and effectively develop a three-dimensional structure that is fully functional.
This piece of work has been carried out to explore the different ventures in this space that can result in efficient optimization of performance and area parameters thereby overcoming different challenges in the process.
The key is to establish proper die to die connections and effectively develop a three-dimensional structure that is fully functional.
Event Type
Engineering Track Poster
TimeMonday, June 245:00pm - 6:00pm PDT
LocationLevel 2 Exhibit Hall
Back-End Design
Embedded Systems
Front-End Design
IP