Presentation
2.5D Design Breakthrough: Unleashing the Power of Automated EMIB Bridges.
DescriptionWith the growing demand for the heterogenous chip interconnect there is a dire need of a unified EDA design environment that effectively handles the complex logical interconnects, physical layout design, EE, mechanical & thermal simulations.
Intel's embedded multi-die interconnect bridge (EMIB) is an approach to in-package high-density interconnect of heterogeneous chips. With the increasing demand from Intel internal and IFS customer base there is a bigger challenges for tools to handle highly complex design with 10s of complex chiplets and their connectivity management, low latency high bump count layout and reliable interconnects that can be seamlessly simulate with EDA tools.
Intel's collaboration with Cadence on automating the 2.5D design is a significant step towards making EMib technology a more widely adopted and efficient solution for high-performance chip design. This will significantly benefit other companies and researchers working in this field.
Intel's embedded multi-die interconnect bridge (EMIB) is an approach to in-package high-density interconnect of heterogeneous chips. With the increasing demand from Intel internal and IFS customer base there is a bigger challenges for tools to handle highly complex design with 10s of complex chiplets and their connectivity management, low latency high bump count layout and reliable interconnects that can be seamlessly simulate with EDA tools.
Intel's collaboration with Cadence on automating the 2.5D design is a significant step towards making EMib technology a more widely adopted and efficient solution for high-performance chip design. This will significantly benefit other companies and researchers working in this field.
Event Type
Engineering Track Poster
TimeMonday, June 245:00pm - 6:00pm PDT
LocationLevel 2 Exhibit Hall
Back-End Design
Embedded Systems
Front-End Design
IP